A tanszéki kutatók és oktatók utóbbi évében elfogadott nemzetközi folyóiratcikkei az alábbi listában találhatók. Az adott cikkek a DOI hivatkozásokkal (megfelelő előfizetés esetén) letölthetőek.
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E. Hutli, A. Bonyár, D. Oszetzky, M.S. Nedeljkovic: "Plastic Deformation and Modification of Surface Characteristics in Nano and Micro Levels and Enhancement of Electric Field of FCC Materials Using Cavitaion Phenomenon", Mechanics of Materials, Vol. 92, pp. 289-298, (2016), DOI: http://dx.doi.org/10.1016/j.mechmat.2015.10.006, IF(2014): 2,329 |
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B. Illés , O. Krammer , A. Géczy , T. Garami: "Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes", Soldering & Surface Mount Technology, Vol. 28 Iss: 1, pp. 2–6, (2016), DOI: http://dx.doi.org/10.1108/SSMT-10-2015-0030, IF(2014): 0,872 |
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T. Garami , O. Krammer , G. Harsányi , P. Martinek: "Method for validating CT length measurement of cracks inside solder joints", Soldering & Surface Mount Technology, Vol. 28 Iss: 1, pp. 13–17, (2016), DOI: http://dx.doi.org/10.1108/SSMT-10-2015-0029, IF(2014): 0,872 |
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A. Géczy , B. Kvanduk , B. Illés , G. Harsányi: "Comparative study on proper thermocouple attachment for vapour phase soldering profiling", Soldering & Surface Mount Technology, Vol. 28 Iss: 1, pp. 7–12, (2016), DOI: http://dx.doi.org/10.1108/SSMT-10-2015-0033, IF(2014), 0,872 |
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B, Illés, T, Hurtony, B, Medgyes: "Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys", Corrosion Science, 99: pp. 313-319. (2015), http://dx.doi.org/10.1016/j.corsci.2015.07.026, IF (2014): 4.42 |
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Zs. Csobán, B. Kállai-Szabó, N. Kállai-Szabó, I. Sebe, P. Gordon, I. Antal: "Improvement of mechanical properties of pellet containing tablets by thermal treatment", International Journal of Pharmaceutics, 496(2):489-96. (2015) http://dx.doi.org/10.1016/j.ijpharm.2015.10.040. IF(2014): 3,65 |
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A. Géczy, B. Illés, Zs. Péter, Zs. Illyefalvi-Vitéz: "Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards", Heat and Mass Transfer, March 2015, Volume 51, Issue 3, pp 335-342. (2015) http://dx.doi.org/10.1007/s00231-014-1386-1 IF(2014): 0.946 |
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A. Géczy , B. Illés, T. Darnai: "Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates", International Journal of Heat and Mass Transfer, Volume 86, July 2015, pp. 639–647 (2015) http://dx.doi.org/10.1016/j.ijheatmasstransfer.2015.02.068 IF(2014): 2.383 |
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A. Géczy , M. Fejős, L. Tersztyánszky: "Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering", Soldering and Surface Mount Technology, Volume: 27, Issue: 2 pp. 639–647 (2015) http://dx.doi.org/10.1108/SSMT-07-2014-0014 IF(2014): 0.872 |
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J. Burunkova, S. Kokenyesi, I. Csarnovics, A. Bonyár, M. Veres, A. Csik: "Influence of gold nanoparticles on the photo-polymerization processes and structure in acrylate nanocomposites", European Polymer Journal, Volume 64, March 2015, pp. 189–195 (2015) http://dx.doi.org/10.1016/j.eurpolymj.2015.01.011 IF(2014): 3.005 |
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J. Kámán: "Young’s Modulus and Energy Dissipation Determination Methods by AFM, with Particular Reference to a Chalcogenide Thin Film", Periodica Polytechnica Electrical Engineering and Computer Science, V59(1), pp. 18-25, (2015) http://dx.doi.org/10.3311/PPee.7865 IF(2014): - |
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B. Medgyes, B. Horváth, B. Illés, T. Shinohara, A. Tahara, G. Harsányi, O. Krammer: "Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics", Corrosion Science, Vol. 92, pp. 43-47, (2015), DOI: http://dx.doi.org/10.1016/j.corsci.2014.11.004, IF(2014): 4,422 |
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O. Krammer, T. Garami, B. Horváth, T. Hurtony, B. Medgyes, L. Jakab: "Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders", Journal of Alloys and Compounds, Vol. 634, pp. 156-162, (2015), DOI: http://dx.doi.org/10.1016/j.jallcom.2015.02.092, IF(2014): 2,999
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T. Garami, O. Krammer: "Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys", Journal of Materials Science: Materials in Electronics, Vol. 26, pp. 8540-8547, (2015), DOI: http://dx.doi.org/10.1007/s10854-015-3526-x, IF(2014): 1,569 |
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